EPIC members in the News

  • Yenista opens Sales Support & Repair Center in California, USA[ 12/08/2014 ]
    Center aims to support the growing demand for its test equipment from semiconductor manufacturers developing silicon photonic technologies

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  • Hamamatsu new camera pushes the limits of low light detection[ 08/08/2014 ]
    Hamamatsu Photonics has introduced a successor to the ORCA II range

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  • Julius Springer Prize for Applied Physics Honors Pioneering Achievements in Plasmonics and Nanophotonics[ 08/08/2014 ]
    Julius Springer Prize for Applied Physics awarded to Dr. Harry A. Atwater (Caltech Pasadena, USA) and Dr. Albert Polman (FOM Institute AMOLF, Amsterdam, The Netherlands)

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  • VI Systems awarded US patent for its 40G VCSEL technology[ 23/07/2014 ]
    High-speed emitter developed by German component maker

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  • New World Record for Concentrator Photovoltaics[ 14/07/2014 ]
    36.7 Percent for New Solar Module Using Highly Efficient Multi-Junction Solar Cells

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More news

Photonics Integration Circuits Packaging Standardization

18-19 June 2014
Hosted by TE Connectivity
Rietveldenweg 32, 5222 AR 's-Hertogenbosch, The Netherlands

This event is a follow-up from the previous meeting hosted by IBM on 5-6 December 2013 in Switzerland (see summary video - article - attendees). The focus of the next meeting is on electronics/photonics integration and constraints, and packaging solution/standardization. Where are standards needed in packaging in photonic integrated circuits? What's the current status? What needs to be done?

Registered participants include (restricted to 1 attendee per company): Adamant, ADVA Optical Networking, AIFOTEC, ALT, BASF Coatings, BESI, Boschman Technologies/APC, Bright Photonics, CEA-LETI, CMC Microsystems, Corning, Eindhoven University of Technology, Entroptix, EPIC, ficonTEC, Finetech, Fraunhofer HHI, greenTEG AG, HAT Lab, Huawei (Caliopa), Huawei European Research Center, IBM, III-V lab, Karlsruhe Institute of Technology (KIT), LioniX, Lovalite , Multiphoton Optics, Nanium, Oclaro, OneChip Photonics, Optocap, PandA, PARADIGM, Phoenix Software, PI miCos , PNO, Prysmian Group, SATRAX, Sencio, Southampton University, SQS, Sumitomo Bakelite , TE Connectivity, Technobis ipps, Tyndall, University of Paderborn, US Conec, VTT, XiO Photonics, Xyratex, Yelo.


Accomodation Golden Tulip Hotel Central. Burg. Loeffplein 98, 5211 RX 's-Hertogenbosch (Den Bosch), The Netherlands. Price per night: 113.50 EUR. Wifi included, breakfast excluded. To reserve, send an email with your arrival/departure date to Karin Verbakel

Transport Direct train connections from Amsterdam Schiphol airport to 's-Hertogenbosch train station every 30 minutes. From train station in 's-Hertogenbosch take a taxi to TE approximately 5 minutes ride about 8 EUR. For further question contact Karin Verbakel

Registration & Fee
  • Participation is strictly limited to 60 attendees. 1 representative per company.
  • EPIC Members and Speaker (priority): 130 EUR. Non-Member 325 EUR.
  • Register Online

Payment: Pay prior to the event by invoice (contact Martine at keim-paray@epic-assoc.com) or credit card (receipt will automatically be emailed). EPIC members and invited participants: 130 EUR +VAT. Non-Member 325 EUR +VAT.

Registration PICs Workshop

EPIC Technology Workshops Concept
EPIC events are mainly on-invitation and limited in size, ensuring that experts and leaders on the topic can openly discuss and exchange to address technological and commercial advancement, and explore collaboration opportunities. After the workshop, a summary will be shared and next action items defined. Networking is an important ingredient to a successful workshop, a list of participants will be shared in advance, and several networking opportunities available through-out the event.