8 June 2020 / 16:00 - 18:30
EPIC Online Technology Meeting on Co-packaged Optics (in cooperation with COBO & EA)
Online Event



Co-packaging silicon and photonic elements will provide the most efficient way to handle the needs of high-speed silicon I/O. In this meeting, we will review the last developments on co-packaged optics identifying collaborations and user requirements.

Spirit of the meetings

PIC Online Technology Meetings are neither ordinary webinars nor conventional online meetings. They are extraordinary in terms of their speakers, attendees, and moderators.

Only a limited group of people will join each meeting. The speakers and attendees represent companies along the entire value chain: component suppliers, system integrators, and end-users.

The spirit of the meetings is to identify ways and reasons for working together. Speakers will give a short presentation about their technologies, solutions and needs related to the topic, and will answer the EPIC questions: “What can they do for you? What can you do for them?” Together with the attendees in the Zoom room, they will exchange expertise and new visions in a round table discussion, which will be continued at the end of the meeting resulting in new business relationships.

Speakers
Director of European Photonic Packaging Pilot Line & Head of Research Group at Tyndall National Institute
CEO at ficonTEC
Senior Program Manager at Teledyne
CEO at vario-optics
Vincent Lin
Director for Corporate R&D at ASE Global
Chief Scientist at SABIC
Product Manager at Cisco
CEO at Optics
Sales Engineer & Senior Technologist at Senko
Product Manager at Optiwave
Attendees
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