24 April 2020 / 15:00 - 17:30
EPIC Online Technology Meeting on Photonics Packaging and Testing
Online Event



Attendees, including assembly and test service providers and tool/equipment manufacturers, will discuss about the packaging and testing of optical modules including passive/active optical alignment, wafer-level vs die level packaging and testing, thermal considerations or volume vs prize.

You can find the full transcript of the meeting here for download.

Speakers
Director of European Photonic Packaging Pilot Line & Head of Research Group at Tyndall National Institute
Test Manager at VLC Photonics
CEO at ficonTEC
Product Manager Test & Measurement at Jenoptik Optical Systems
CTO at Aixemtec
Product Manager at Finetech
Sales Manager at First Sensor
Founder & CTO at Technobis
Research Team Leader at VTT
Head of Photonics at PI
Attendees
Moderator
Dr. Jose Pozo
Dr. Jose Pozo
Director of Technology and Innovation
Event Manager
Helena Jelinkova
Helena Jelinkova
Events Manager
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