21 November 2022 / 15:00 - 17:00
EPIC Online Technology Meeting on PIC Packaging and Testing
Online Event


Free Event
Free Event
$0


In this meeting, we will discuss about new trends and considerations for packaging and testing of optical modules including passive/active optical alignment, wafer-level vs die level packaging and testing, thermal control, volume vs prize and new manufacturing needs in co-package optics. Key players in the packaging field will discuss about the adoption of standards, packaging requirements for new applications including quantum photonics.

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Moderators
Dr. Ivan Nikitski
Dr. Ivan Nikitski
Photonics Technology Manager
Dr. Panagiotis Vergyris
Dr. Panagiotis Vergyris
Photonics Technology Manager
Event Manager
Helena Jelinkova
Helena Jelinkova
Events Manager
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