26 April 2021 / 15:00 - 17:00
EPIC Online Technology Meeting on PIC Packaging
Online Event



In this meeting, we will have an update about new trends and considerations for packaging and testing of optical modules including passive/active optical alignment, wafer-level vs die level packaging and testing, thermal control, volume vs prize and new manufacturing needs in co-package optics. Key players in the packaging field will discuss about the adoption of standards, packaging requirements for new applications and development of large-volume manufacturing processes.

Spirit of the meetings

During these online technology meetings, we are looking for the challenges the industry is facing and bringing together the entire supply chain to address these challenges. Bringing together end-users with component suppliers and system integrators that will answer the EPIC question “What can you do for them and what can they do for you” creates the perfect foundation to establish new business relationships and find ways for new collaborations and partnerships.

Speakers

He previously founded two photonic companies and established the Photonics Packaging and Integration Group at Tyndall in 2009. Peter is also Deputy Director of the Irish Photonics Integration Centre.

Director at PIXAPP

Michael is also a part-time full professor, and chair of optoelectronics at Glyndwr University in Wales, UK. He has been focusing on InP-based PICs and optoelectronic integrated circuits (OEICs) for the datacenter segment.

He worked in speech recognition with Hidden Markov Model and Neural Networks algorithms. Alexander is co-author of several papers and an inventor on 14 patents, and he worked on high-end packaging for the last decade.

He is working in InP based MZ-Modulator development and introduced Co-Designs with driver and new packaging approaches to achieve high bandwidths and low power consumption. He is author and coauthor of more than 60 papers and holds 13 patents.

Senior Project Manager at Fraunhofer HHI

He held several positions in engineering, research, technology scouting, and management. Jeroen is the author and co-author of several publications and holds 15 patent applications in the field of optical interconnection technology.

Chief Commercial Officer at PHIX
Attendees
Promo Video
Moderator
Dr. Jose Pozo
Dr. Jose Pozo
Director of Technology and Innovation
Event Manager
Neringa Noreikiene
Neringa Noreikiene
Events Manager
Media Partner/s
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