He previously founded two photonic companies and established the Photonics Packaging and Integration Group at Tyndall in 2009. Peter is also Deputy Director of the Irish Photonics Integration Centre.
In this meeting, we will have an update about new trends and considerations for packaging and testing of optical modules including passive/active optical alignment, wafer-level vs die level packaging and testing, thermal control, volume vs prize and new manufacturing needs in co-package optics. Key players in the packaging field will discuss about the adoption of standards, packaging requirements for new applications and development of large-volume manufacturing processes.
He previously founded two photonic companies and established the Photonics Packaging and Integration Group at Tyndall in 2009. Peter is also Deputy Director of the Irish Photonics Integration Centre.
Michael is also a part-time full professor, and chair of optoelectronics at Glyndwr University in Wales, UK. He has been focusing on InP-based PICs and optoelectronic integrated circuits (OEICs) for the datacenter segment.
He worked in speech recognition with Hidden Markov Model and Neural Networks algorithms. Alexander is co-author of several papers and an inventor on 14 patents, and he worked on high-end packaging for the last decade.
He is working in InP based MZ-Modulator development and introduced Co-Designs with driver and new packaging approaches to achieve high bandwidths and low power consumption. He is author and coauthor of more than 60 papers and holds 13 patents.
He held several positions in engineering, research, technology scouting, and management. Jeroen is the author and co-author of several publications and holds 15 patent applications in the field of optical interconnection technology.