13-14 November 2023
EPIC Technology Meeting on Microelectronics & Photonics – Two Sides of One Coin
Munich, Germany

EPIC Members
290.00 Excl. VAT
Invited companies
290.00 Excl. VAT
Non-members
490.00 Excl. VAT


The EPIC Microelectronics & Photonics Meeting aims to address technology and manufacturing challenges and opportunities in the microelectronics and photonics industries. Key industry actors from both fields will convene to explore how they can collaborate to solve each other’s problems and learn from one another. Participants from across the entire manufacturing value chain, including design, manufacturing, testing, packaging, equipment, and materials, will attend the event, which is known for its extensive networking opportunities. The meeting will be held in Munich in conjunction with the SEMICON Europa exhibition, which represents the semiconductor equipment and materials industry, and is conveniently located near Messe Munich.

Agenda

SESSION 1: Production – Photonics in Volume

Applied Materials – Gauthier Briere, Product Marketing Manager
Global Foundries – Steven Palmer, Product Manager
Speaker 3 – TBA.
Speaker 4 – TBA.
Speaker 5 – TBA.

SESSION 2: Design and Metrology – News

Fraunhofer IZM – Tolga Tekin, Professor
Chip Integration Technology Center (CITC) – Sander Dorrestein, Senior Micro-Electronic & Optical Packaging Process Development Engineer
ANSYSEmpowering Future AI Compute with Optical Interconnects – Shin-Sung Kim, Manager Application Engineering
Speaker 4 – TBA.
Speaker 5 – TBA.

SESSION 3: Materials – Heterogeneous Integration

Lightwavelogic – Michael Lebby, CEO
IQE – Iwan Davies, Group Technology Director
IMEC – Amin Abbasi, Senior Business Development Manager
Speaker 4 – TBA.
Speaker 5 – TBA.

SESSION 4: Equipment

KEYNOTE: ASMLASML 200mm Products Targeting Emerging Markets, like Photonics – Syed Zaid Ali, Business Development Manager
Posalux – Udo Heinzel, CTO
Suss Microtec – Hosgoer Sarioglu, Director Corporate Marketing
Plasma-ThermElectronics and Photonics:  Overlapping Plasma Processing Requirements – TBA.
Speaker 5 – TBA.

Location

Will be announced soon.

Speakers
Director Corporate Marketing at SÜSS MicroTec
Product Marketing Manager at Applied Materials
Product Manager at Global Foundries
Manager Application Engineering at ANSYS
Group Technology Director at IQE
Senior Business Development Manager at IMEC
Business Development Manager at ASML
Senior Micro-Electronic & Optical Packaging Process Development Engineer at Chip Integration Technology Center (CITC)
TBA.
TBA. at Plasma-Therm


More speakers will be announced soon.

Supported By
Program Manager
Ivan Nikitski, PhD
Ivan Nikitski, PhD
Technology Manager for Quantum and PICs
Event Manager
Neringa Noreikiene
Neringa Noreikiene
Events Manager