12 November, 2023, Sunday
20:00 – 22:30 Optional dinner @Schneider Bräuhaus München
13 November, 2023, Monday
13:00 – 13:50 Registration and light lunch @ conference room B22, in hall B2
13:50 – 14:00 Opening of the meeting @ conference room B21
SESSION 1: Production – Photonics in Volume
14:00 – 14:15 Speaker 1 – TBA.
14:15 – 14:30 X-fab – Joni Mellin, Product Marketing, Photonics (Germany)
14:30 – 14:45 Applied Materials – Gauthier Briere, Product Marketing Manager (France)
14:45 – 15:00 Lightwavelogic – Michael Lebby, CEO (USA)
15:00 – 15:15 Future Horizons – Two Sides Of One Coin? – Malcolm Penn, Chairman & CEO (United Kingdom)
15:15 – 16:00 Networking coffee break
SESSION 2: Photonics in Volume – Advanced Equipment
16:00 – 16:30 KEYNOTE: ASML – ASML 200mm Products Targeting Emerging Markets, like Photonics – Syed Zaid Ali, Business Development Manager
16:30 – 16:45 Pibond – Thomas Gädda, CTO (Finland)
16:45 – 17:00 Suss Microtec – Hosgoer Sarioglu, Director Corporate Marketing (Germany)
17:00 – 17:15 Plasma-Therm – Electronics and Photonics: Overlapping Plasma Processing Requirements – Thierry Lazerand, Director Business Unit (France)
17:15 – 17:30 Posalux – Udo Heinzel, CTO (Switzerland)
17:30 – 17:45 Bühler Group – Daniel Sa Pereira, Sales Manager (Germany)
18:00 Bus transfer/walk to the restaurant
18:00 – 22:00 Networking dinner (venue – TBA.)
14 November, 2023, Tuesday
08:20 – 08:50 Morning coffee break
08:50 – 09:00 Introduction day 2
SESSION 3: Photonic Chips – Integration of Materials
09:00 – 09:15 IMEC – Amin Abbasi, Senior Business Development Manager (Belgium)
09:15 – 09:30 Smart Photonics – TBA.
09:30 – 09:45 Global Foundries – Vikas Gupta, Product Manager for SIlicon Photonics (The United States)
09:45 – 10:00 X-celeprint – Ruggero Loi, Supply Chain Scientist (Ireland)
10:00 – 10:15 IQE – Iwan Davies, Group Technology Director (United Kingdom)
10:15 – 11:00 Networking coffee break
SESSION 4: Photonic Chips – Design, Metrology, and Packaging
11:00 – 11:15 Fraunhofer IZM – Tolga Tekin, Group Manager (Germany)
11:15 – 11:30 ANSYS – Empowering Future AI Compute with Optical Interconnects – Shin-Sung Kim, Manager Application Engineering (United Kingdom)
11:30 – 11:45 Chip Integration Technology Center (CITC) – Sander Dorrestein, Senior Micro-Electronic & Optical Packaging Process Development Engineer (The Nederlands)
11:45 – 12:00 TBA
12:00 – 12:15 Vanguard Automation – Thorsten Mayer, CEO (Germany)
12:15 – 12:30 Nanoscribe – From Mastering to Aligned Printing – Enabling Photonics Systems Production with 2GL – Jörg Smolenski, Business Development Manager (Germany)
12:30 – 12:45 Speaker TBA.
12:45 – 14:00 Lunch break
13:30 End of the meeting
