EPIC Meeting on Integrated Photonics at Fraunhofer IZM, a groundbreaking event that brings together industry leaders, experts in photonics, and end-users from around the globe in the dynamic realm of integrated photonics. Hosted by the prestigious Fraunhofer Institute for Reliability and Microintegration (IZM), this meeting aims to foster collaborative discussions and explore the frontiers of integrated photonics technology and scalable packaging of photonic chips. As the demand for faster, smaller, and more efficient electronic devices continues to surge, integrated photonics has emerged as a transformative technology. It offers a myriad of opportunities to revolutionize various sectors, including telecommunications, data centers, healthcare, and sensing applications. Fraunhofer IZM, renowned for its pioneering research in microsystems and packaging technology, is at the forefront of advancing integrated photonics, enabling innovative solutions with unparalleled performance and reliability. The EPIC Meeting serves as a nexus where industry pioneers, entrepreneurs, investors, researchers, and decision-makers can converge to exchange knowledge, share experiences, and collaborate on the future prospects of integrated photonics. With an emphasis on scalable packaging of photonic chips, participants will delve into cutting-edge advancements in chip-scale integration, heterogeneous integration, advanced packaging techniques, and novel manufacturing processes.
3 June 2024, Monday
Company visits (Separate registration needed, number of people is limited to 18 participants)
09:10 Gather at MOXY BERLIN HUMBOLDTHAIN PARK (address: Hochstraße 2, 13357 Berlin)
09:15-10:00 Drive
10:00-11:30 Fraunhofer HHI (address: Einsteinufer 37, 10587 Berlin, Germany)
11:30-12:15 Drive
12:15-13:30 Sicoya ((address: Carl-Scheele-Straße 16, 12489 Berlin, Germany)
13:30-14:30 Lunch
14:30-16:00 AEMTEC (address: James-Franck-Straße 10, 12489 Berlin, Germany)
18:30 – 21:30 Optional pre-event dinner @Restaurant MOXY (address: Humboldthain Park, Hochstraße 2-3, D-13357 Berlin)
4 June 2024, Tuesday
13:30 – 15:30 SESSION 1: Integrated Photonics in Volume
15:30 – 16:15 Networking coffee break
16:15 – 18:15 SESSION 2: Advanced Packaging
5 June 2024, Wednesday
08:45 – 10:30 SESSION 3: Photonics Packaging in Volume
10:30 – 11:15 Networking coffee break
11:15 – 12:45 SESSION 4: Reliability and Testing
We recommend to book your room at the MOXY BERLIN HUMBOLDTHAIN PARK (address: Hochstraße 2, 13357 Berlin) directly on their website or booking.com or any other hotel nearby.
Fraunhofer Heinrich Hertz Institute does research on communications since more than 90 years. Nowadays, about every second bit transported in the internet touches HHI InP technology on its way to the receiver. With a strong focus on InP, we also develop polymer waveguide based hybrid integration and SiNx photonics. While our expertise is strongest in high performance (100 GBit/sec and above) data- and telecom, we have strongly increasing activities in communication and sensor systems, e.g. based on Terahertz and LiFi technology. We regularly offer multi-project wafers in InP. Our partners have the choice to do the design themselves and just use us as a foundry or to get both design and chips from a single source.
Sicoya a spin off from TU Berlin, is developing silicon photonics (SiPh) based photonic integrated circuits (PICs) for optical data center interconnects using a fabless business model. The founding team raised 4.9 M€ of nonrepayable public funds for R&D in the last 8 years. Sicoya aims to enter the market with a 4×25 Gbit/s sealed and packaged transceiver chip for intra data center connections with link distances up to 2 km. Sicoya designs, packages and sells silicon photonic based Application Specific Photonic Integrated Circuits (ASPICs). Our technology enables the production of highly integrated optical transceivers at very low manufacturing costs.
AEMtec is a global acting specialist for the development and production of customized and reliable micro- and optoelectronics. In the sector of miniaturization AEMtec provides a wide technology portfolio including Wafer Back-End Services, Chip on Board, Flip Chip, 3D Integration and Opto Packaging; all realized in cleanroom environment (ISO class 5 to 8). From concept to serial production including design and development, process management and industrialization the customers benefit from the services by a single source provider. AEMtec is certified by official organizations: ISO 9001, ISO 13485 (Medical) and ISO 14001 (Environment).
Dr. Hektor Meier obtained his PhD from the Swiss Federal Institute of Technology (ETH) in 2011. Shortly after he became a member of the product development team of Enablence Switzerland and later Albis Optoelectronics. He was responsible for the development of ultra high speed InGaAs PIN and avalanche photodiodes. Since 2016 he acts as Head of Product Development at Albis and is in charge of the technology development and expansion of the product portfolio.
Dr. Hektor Meier obtained his PhD from the Swiss Federal Institute of Technology (ETH) in 2011. Shortly after he became a member of the product development team of Enablence Switzerland and later Albis Optoelectronics. He was responsible for the development of ultra high speed InGaAs PIN and avalanche photodiodes. Since 2016 he acts as Head of Product Development at Albis and is in charge of the technology development and expansion of the product portfolio.
Dr. Hektor Meier obtained his PhD from the Swiss Federal Institute of Technology (ETH) in 2011. Shortly after he became a member of the product development team of Enablence Switzerland and later Albis Optoelectronics. He was responsible for the development of ultra high speed InGaAs PIN and avalanche photodiodes. Since 2016 he acts as Head of Product Development at Albis and is in charge of the technology development and expansion of the product portfolio.