EPIC Meeting on Integrated Photonics at Fraunhofer IZM, a groundbreaking event that brings together industry leaders, experts in photonics, and end-users from around the globe in the dynamic realm of integrated photonics. Hosted by the prestigious Fraunhofer Institute for Reliability and Microintegration (IZM), this meeting aims to foster collaborative discussions and explore the frontiers of integrated photonics technology and scalable packaging of photonic chips. As the demand for faster, smaller, and more efficient electronic devices continues to surge, integrated photonics has emerged as a transformative technology. It offers a myriad of opportunities to revolutionize various sectors, including telecommunications, data centers, healthcare, and sensing applications. Fraunhofer IZM, renowned for its pioneering research in microsystems and packaging technology, is at the forefront of advancing integrated photonics, enabling innovative solutions with unparalleled performance and reliability. The EPIC Meeting serves as a nexus where industry pioneers, entrepreneurs, investors, researchers, and decision-makers can converge to exchange knowledge, share experiences, and collaborate on the future prospects of integrated photonics. With an emphasis on scalable packaging of photonic chips, participants will delve into cutting-edge advancements in chip-scale integration, heterogeneous integration, advanced packaging techniques, and novel manufacturing processes.